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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11845746
Filing Dt:
08/27/2007
Publication #:
Pub Dt:
10/16/2008
Inventors:
Kuo-Yao Cho, Wen-Bin Wu, Chiang-Lin Shih, Chia-Cheng Lin
Title:
METAL INTERCONNECT STRUCTURE
Assignment: 1
Reel/Frame:
019751/0290Recorded: 08/27/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/28/2006
Exec Dt:
11/28/2006
Exec Dt:
11/28/2006
Exec Dt:
11/28/2006
Assignee:
HWA-YA TECHNOLOGY PARK 669, FUHSING 3 RD., KUEISHAN
TAO-YUAN HSIEN, TAIWAN
Correspondent:
WINSTON HSU
P.O.BOX 506
MERRIFIELD, VA 22116

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