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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8485120
Issue Dt:
07/16/2013
Application #:
11735987
Filing Dt:
04/16/2007
Publication #:
20080254225
Pub Dt:
10/16/2008
Inventors:
William Thie, John M. Boyd, Jacob Wylie, Fritz C. Redeker, Yezdi Dordi, John Parks et al
Title:
Method and Apparatus for Wafer Electroless Plating
Assignment: 1
Reel/Frame:
019167/0630Recorded: 04/16/2007Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
THIE, WILLIAM
Exec Dt:
03/30/2007
BOYD, JOHN M.
Exec Dt:
04/11/2007
REDEKER, FRITZ C.
Exec Dt:
04/02/2007
DORDI, YEZDI
Exec Dt:
03/30/2007
PARKS, JOHN
Exec Dt:
04/02/2007
ARUNAGIRI, TIRUCHIRAPALLI
Exec Dt:
03/30/2007
OWCZARZ, ALEKSANDER
Exec Dt:
04/02/2007
BALISKY, TODD
Exec Dt:
04/02/2007
THOMAS, CLINT
Exec Dt:
03/30/2007
WYLIE, JACOB
Exec Dt:
03/30/2007
Assignee:
LAM RESEARCH CORPORATION
4650 CUSHING PARKWAY
FREMONT, CALIFORNIA 94538
Correspondent:
KENNETH D. WRIGHT
710 LAKEWAY DRIVE
SUITE 200
SUNNYVALE, CA 94085
Assignment: 2
Reel/Frame:
020722/0089Recorded: 03/28/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
SCHOEPP, ALAN M.
Exec Dt:
02/21/2008
Assignee:
LAM RESEARCH CORPORATION
4650 CUSHING PARKWAY
FREMONT, CALIFORNIA 94538
Correspondent:
KENNETH D. WRIGHT
710 LAKEWAY DRIVE
SUITE 200
SUNNYVALE, CA 94085

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