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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11571125
Filing Dt:
01/21/2008
Publication #:
Pub Dt:
10/16/2008
Inventors:
Hisataka Nakashima, Hideki Kobayashi
Title:
Integrally Molded Body of Silicone Resin and Silicone Rubber, Method of Manufacture, and Curable Silicone Resin Composition
Assignment: 1
Reel/Frame:
020391/0321Recorded: 01/21/2008Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/13/2007
Exec Dt:
02/25/2007
Assignee:
1-3, MARUNOUCHI 1-CHOME
CHIYODA-KU, TOKYO, JAPAN 100-0005
Correspondent:
DAVID M. LAPRAIRIE
39400 WOODWARD AVENUE, SUITE 101
THE PINEHURST OFFICE CENTER
BLOOMFIELD HILLS, MI 48304-5151

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