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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11758886
Filing Dt:
06/06/2007
Publication #:
Pub Dt:
10/23/2008
Inventors:
Hua Yang, Yong Liu
Title:
LEAD FRAME FREE PACKAGE AND METHOD OF MAKING
Assignment: 1
Reel/Frame:
022042/0810Recorded: 12/31/2008Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/16/2007
Exec Dt:
05/15/2007
Assignee:
82 RUNNING HILL ROAD
MS 35-4E
SOUTH PORTLAND, MAINE 04106
Correspondent:
THOMAS R. FITZGERALD, ESQ.
HISCOCK & BARCLAY, LLP
2000 HSBC PLAZA, 100 CHESTNUT ST.
ROCHESTER, NY 14604-2404
Assignment: 2
Reel/Frame:
057694/0374Recorded: 08/03/2021Pages: 381
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/22/2021
Assignee:
5005 E. MCDOWELL ROAD, MD A700
PHOENIX, ARIZONA 85008
Correspondent:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD
MD A700
PHOENIX, AZ 85008

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