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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11977577
Filing Dt:
10/25/2007
Publication #:
Pub Dt:
10/23/2008
Inventors:
Kunihiro Yamada, Akihiro Endo, Kei Miyoshi
Title:
Method for adhering a thermally-conductive silicone composition, a primer for adhering a thermally-conductive silicone composition and a method for manufacturing a bonded complex of a thermally-conductive silicone composition
Assignment: 1
Reel/Frame:
020435/0229Recorded: 01/29/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/14/2007
Exec Dt:
09/18/2007
Exec Dt:
09/14/2007
Assignee:
6-1, OHTEMACHI 2-CHOME
CHIYODA-KU, TOKYO 100-0004, JAPAN
Correspondent:
ARLES A. TAYLOR, JR.
JENKINS, WILSON, TAYLOR & HUNT, P.A.
SUITE 1200 UNIVERSITY TOWER
3100 TOWER BOULEVARD
DURHAM, NC 27707

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