Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12103400
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Filing Dt:
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04/15/2008
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Publication #:
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Pub Dt:
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10/30/2008
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Inventors:
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Xuan Zhu, Mengfeng Tsai
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Title:
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Chemical Mechanical Polishing Process for Planarizing Copper Surface
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18 ZHANG JIANG ROAD, PUDONG NEW AREA |
| SHANGHAI, CHINA 201210 |
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| SQUIRE SANDERS & DEMPSEY LLP |
| ONE MARITIME PLAZA |
| SUITE 300 |
| SAN FRANCISCO, CA 94111 |
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