Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12070527
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Filing Dt:
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02/19/2008
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Publication #:
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Pub Dt:
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10/30/2008
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Inventors:
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Chen-Feng Kuan, Chia-Hsun Chen, Min-Chi Chung, Hsu-Chiang Kuan, Kun-Chang Lin et al
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Title:
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Recycled thermosetting flour composites and method for preparing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 49 CHUNG HUA ROAD |
| HSIN-SHIH |
| TAINAN, TAIWAN R.O.C. |
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| DANIEL J. HUDAK |
| HUDAK, SHUNK & FARINE CO. LPA |
| 2020 FRONT STREET, SUITE 307 |
| CUYAHOGA FALLS, OH 44221 |
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