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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11576604
Filing Dt:
04/04/2007
Publication #:
Pub Dt:
11/13/2008
Inventors:
Daisuke Sawaki, Susumu Sano, Kenichi Homma, Kouki Ichitsubo, Kenichi Matsumoto et al
Title:
Solidification Material
Assignment: 1
Reel/Frame:
021486/0235Recorded: 09/05/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/15/2007
Exec Dt:
03/14/2007
Exec Dt:
03/15/2007
Exec Dt:
03/15/2007
Exec Dt:
03/15/2007
Exec Dt:
03/15/2007
Assignee:
8-1, AKASHI-CHO, CHUO-KU
TOKYO, JAPAN 104-8518
Correspondent:
OBLON, SPIVAK, ET AL.
1940 DUKE STREET
ALEXANDRIA, VA 22314

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