Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11910651
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Filing Dt:
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05/01/2008
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Publication #:
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Pub Dt:
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11/13/2008
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Inventors:
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Yorinobu Takamatsu, Yusuke Saito, Akira Yoda
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Title:
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Method of Reusing Flexible Mold and Microstructure Precursor Composition
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 33427 |
| ST. PAUL, MINNESOTA 55133-3427 |
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| 3M INNOVATIVE PROPERTIES COMPANY |
| PO BOX 33427 |
| ST. PAUL, MN 55133-3427 |
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