Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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10/04/2011
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Application #:
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12108563
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Filing Dt:
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04/24/2008
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Publication #:
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Pub Dt:
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11/20/2008
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Inventors:
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Roel Robles, Danny Retuta, Mary Annie Cheong, Hien Boon Tan, Anthony Yi Sheng Sun et al
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Title:
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SEMICONDUCTOR PACKAGE WITH UNDER BUMP METALLIZATION ALIGNED WITH OPEN VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 SERANGOON NORTH AVENUE 5 |
| SINGAPORE, SINGAPORE 554916 |
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| CARL J. PELLEGRINI |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, DC 20037 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE TO ADD THE ANNEX A AND THE ANNEX B WHICH WAS INADVERTENTLY LEFTOUT IN THE ORIGINAL ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED ON REEL 037959 FRAME 0822. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
4
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CORRECTIVE ASSIGNMENT TO CORRECT THE INCLUDE PATENT NUMBER 8816482 PREVIOUSLY RECORDED AT REEL: 039885 FRAME: 0541. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, SINGAPORE |
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