Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/12/2010
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Application #:
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11751786
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Filing Dt:
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05/22/2007
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Publication #:
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Pub Dt:
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11/27/2008
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Inventors:
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Sungjun Chun, Anand Haridass, Roger D. Weekly
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Title:
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MULTI-LAYER CIRCUIT SUBSTRATE AND METHOD HAVING IMPROVED TRANSMISSION LINE INTEGRITY AND INCREASED ROUTING DENSITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| CASIMER K. SALYS |
| 11400 BURNET ROAD |
| IBM-INTELLECTUAL PROPERTY LAW |
| AUSTIN, TX 78758 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME PREVIOUSLY RECORDED AT REEL: 019327 FRAME: 0325. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION |
| 11501 BURNET ROAD |
| INTELLECTUAL PROPERTY LAW |
| AUSTIN, NY 78758 |
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