Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10581395
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Filing Dt:
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08/14/2008
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Publication #:
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Pub Dt:
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11/27/2008
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Inventors:
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Hien Boon Tan, Chuen Khiang Wang, Rahamat Bidin, Anthony Yi Sheng Sun et al
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Title:
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Chip Scale Package and Method of Assembling the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 SERANGOON NORTH AVENUE 5 |
| SINGAPORE, SINGAPORE 554916 |
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| CARL J. PELLEGRINI |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| WASHINGTON, DC 20037 |
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