Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/30/2010
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Application #:
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11755735
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Filing Dt:
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05/30/2007
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Publication #:
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Pub Dt:
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12/04/2008
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Inventors:
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Sriram Muthukumar, Raul Mancera, Yoshihiro Tomita, Chi-won Hwang
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Title:
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MULTI-CHIP PACKAGING USING AN INTERPOSER WITH THROUGH-VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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| KONRAD RAYNES AND VICTOR LLP |
| 315 S. BEVERLY DR. |
| SUTIE 210 |
| BEVERLY HILLS, CA 90212 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BLANCHARDSTOWN CORPORATE PARK 2 |
| PLAZA 255, SUITE 2A |
| DUBLIN, IRELAND D15 YH6H |
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| TAHOE RESEARCH, LTD. |
| BLANCHARDSTOWN CORPORATE PARK 2 |
| PLAZA 255, SUITE 2A |
| DUBLIN, D15 YH6H IRELAND |
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