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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12136687
Filing Dt:
06/10/2008
Publication #:
Pub Dt:
12/04/2008
Inventor:
Larry D. Kinsman
Title:
REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BONDS AND METHODS OF MAKING SAME
Assignment: 1
Reel/Frame:
022898/0615Recorded: 06/30/2009Pages: 214
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/03/2008
Assignee:
C/O CITCO TRUSTEES (CAYMAN) LIMITED
REGATTA OFFICE PARK, WEST BAY ROAD
GRAND CAYMAN, CAYMAN ISLANDS KY1-1205
Correspondent:
JEFFREY C. ALDRIDGE
KRAMER LEVIN NAFTALIS & FRANKEL LLP
1177 AVENUE OF THE AMERICAS
NEW YORK, NY 10036
Assignment: 2
Reel/Frame:
034037/0711Recorded: 10/23/2014Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/23/2014
Assignee:
5005 E MCDOWELL ROAD
MD A700
PHOENIX, ARIZONA 85008
Correspondent:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E MCDOWELL ROAD
MD A700
PHOENIX, AZ 85008

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