Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11811660
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Filing Dt:
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06/11/2007
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Publication #:
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Pub Dt:
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12/11/2008
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Inventors:
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Hon-Lin Huang, Boe Su, Li-Hsin Tseng, Chia-Jen Cheng, Hsiu-Mei Yu
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Title:
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Through-silicon via interconnection formed with a cap layer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON ROAD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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