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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/14/2016
Application #:
11571787
Filing Dt:
01/08/2007
Publication #:
Pub Dt:
12/11/2008
Inventors:
Werner Blum, Reiner Friedrich, Wolfgang Werner, Reimer Hinrichs
Title:
Fuse in Chip Design
Assignment: 1
Reel/Frame:
023858/0174Recorded: 01/27/2010Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/01/2007
Exec Dt:
07/26/2007
Exec Dt:
03/01/2007
Exec Dt:
03/01/2007
Assignee:
RUNGHOLTSTRABE 8-10
HEIDE, GERMANY 25746
Correspondent:
MITCHELL D. HIRSCH
UNITED PLAZA, SUITE 1600
30 SOUTH 17TH STREET
PHILADELPHIA, PA 19103

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