Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11994743
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Filing Dt:
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06/05/2008
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Publication #:
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Pub Dt:
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12/18/2008
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Inventor:
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Yang Hong Heng
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Title:
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Method for Reliably Positioning Solder on a Die Pad for Attaching a Semiconductor Chip to the Die Pad and Molding Die for Solder Dispensing Apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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| MARK L. GLEASON |
| FIFTH ST. TOWERS, 100 SOUTH FIFTH ST. |
| SUITE 2250 |
| MINNEAPOLIS, MN 55402 |
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