Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/06/2011
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Application #:
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12128163
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Filing Dt:
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05/28/2008
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Publication #:
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Pub Dt:
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12/25/2008
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Inventors:
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Chi Chih Lin, Bo Sun, Hung Jen Wang, Jen Feng Tseng
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Title:
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THIN DOUBLE-SIDED PACKAGE SUBSTRATE AND MANUFACTURE METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 298, GUANDONG ROAD |
| HSINCHU CITY, TAIWAN 300 |
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| WILLIAM J. COOPER |
| ESCHWEILER & ASSOCIATES LLC |
| 629 EUCLID AVENUE, SUITE 1210 |
| CLEVELAND, OHIO 44114 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2F., NO. 98, LN. 879, GUANGFU RD. |
| BADE CITY |
| TAOYUAN COUNTY 334, TAIWAN R.O.C. |
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| MORTON J. ROSENBERG |
| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTTCENTER DRIVE, SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING 1, LEVEL 1, NO. 2300, XUAN HUANG ROAD |
| SHANGHAI, CHINA 201300 |
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| 2F., NO. 98, LN 879, GUANGFU RD. |
| BADE CITY, TAOYUAN COUNTY, TAIWAN 334 |
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| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE, SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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