Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12146643
|
Filing Dt:
|
06/26/2008
|
Publication #:
|
|
Pub Dt:
|
01/01/2009
| | | | |
Inventors:
|
Kwang Suk PARK, In Wook Kim, Duk Sang Han, Dong Ki Nam, Soo Im Jung
|
Title:
|
Resine Composition For Printed Circuit Board and Composite Substrate And Copper Laminates Using The Same
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
DOOSAN TOWER 18F, 18-12, ULCHI-RO 6KA CHUNG-GU |
SEOUL, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 100-730 |
|
|
|
SUGHRUE MION PLLC |
2100 PENNSYLVANIA AVE., N.W. #800 |
WASHINGTON, DC 20037-3213 |
|
|
Search Results as of:
05/30/2024 11:19 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|