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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11825490
Filing Dt:
07/06/2007
Publication #:
Pub Dt:
01/08/2009
Inventors:
Nagesh R. Basavanhally, Raymond A. Cirelli, Avinoam Kornblit
Title:
Solder-bonding process
Assignment: 1
Reel/Frame:
020857/0117Recorded: 04/23/2008Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/26/2007
Exec Dt:
09/25/2007
Exec Dt:
09/25/2007
Assignee:
600-700 MOUNTAIN AVE.
DOCKET ADMINISTRATOR
MURRAY HILL, NEW JERSEY 07974-0636
Correspondent:
JAY M. BROWN
6409 FAYETTEVILLE RD., SUITE 120-306
DURHAM, NORTH CAROLINA 27713

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