Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12281195
|
Filing Dt:
|
08/29/2008
|
Publication #:
|
|
Pub Dt:
|
01/08/2009
| | | | |
Inventors:
|
Takashi Kitae, Seiichi Nakatani, Seiji Karashima, Susumu Sawada, Kenichi Hotehama
|
Title:
|
Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
1006 OAZA KADOMA, KADOMA-SHI |
OSAKA, JAPAN 571-8501 |
|
|
|
KENJI KAMATA |
1130 CONNECTICUT AVE., N.W., SUITE 1100 |
PANASONIC PATENT CENTER |
WASHINGTON, DC 20036 |
|
|
Assignment:
2
|
|
|
|
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
1006 OAZA KADOMA, KADOMA-SHI |
OSAKA, JAPAN 571-8501 |
|
|
|
KENJI KAMATA |
1130 CONNECTICUT AVE., N.W., SUITE 1100 |
PANASONIC PATENT CENTER |
WASHINGTON, DC 20036 |
|
|
Search Results as of:
04/29/2024 07:58 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|