Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10579198
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Filing Dt:
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12/08/2006
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Publication #:
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Pub Dt:
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01/15/2009
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Inventors:
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Wataru Hisada, Kenji Tamaki
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Title:
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Method for manufacturing a solid plating material and the solid plating material manufactured by the method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 51 SHINMEI, UBUKUJI, KITANAGOYA |
| AICHI, JAPAN 481-8678 |
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| KAREN L. WHITEHOUSE |
| 125 SUMMER STREET |
| BROMBERG & SUNSTEIN LLP |
| BOSTON, MA 02110-1618 |
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