Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/31/2011
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Application #:
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12217195
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Filing Dt:
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07/02/2008
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Publication #:
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Pub Dt:
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01/15/2009
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Inventors:
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Se-hoon Cho, Jeung-il Kim, Sang-moo Lee
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Title:
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LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE LEAD FRAME AND METHOD OF FORMING THE LEAD FRAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 SUNGJU-DONG |
| CHANGWON-CITY, KYONGSANGNAM-DO, KOREA, REPUBLIC OF |
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| BRIAN C. RUPP, DRINKER BIDDLE & REATH |
| 191 N. WACKER DRIVE |
| SUITE 3700 |
| CHICAGO, IL 60606-1698 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 84, JEONGDONG-RO, SEONGSAN-GU |
| CHANGWON-SI, GYEONGSANGNAM-DO, KOREA, REPUBLIC OF 641-120 |
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| BRIAN C. RUPP, DRINKER BIDDLE & REATH |
| 191 N. WACKER DRIVE |
| SUITE 3700 |
| CHICAGO, IL 60606-1698 |
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