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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/23/2010
Application #:
12217643
Filing Dt:
07/08/2008
Publication #:
Pub Dt:
01/15/2009
Inventors:
Jong-Seok Lim, Hyo-Dong Ban
Title:
INTERPOSER CHIP, METHOD OF MANUFACTURING THE INTERPOSER CHIP, AND MULTI-CHIP PACKAGE HAVING THE INTERPOSER CHIP
Assignment: 1
Reel/Frame:
021255/0478Recorded: 07/08/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/02/2008
Exec Dt:
07/02/2008
Assignee:
416, MAETAN-DONG, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
DAVID M. MELIO
MILLS & ONELLO LLP
ELEVEN BEACON STREET, SUITE 605
BOSTON, MASSACHUSETTS 02108

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