Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12216850
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Filing Dt:
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07/11/2008
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Publication #:
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Pub Dt:
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01/15/2009
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Inventor:
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Shih-Ping Hsu
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Title:
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Flip-chip package structure, and the substrate and the chip thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-SHIN RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN ROC |
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| RICHARD E. FICHTER |
| BACON & THOMAS, PLLC |
| 625 SLATERS LANE FOURTH FLOOR |
| ALEXANDRIA, VA 22314 |
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