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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7776626
Issue Dt:
08/17/2010
Application #:
11816369
Filing Dt:
08/15/2007
Publication #:
20090017565
Pub Dt:
01/15/2009
Inventors:
Akio Hasebe, Hideyuki Matsumoto, Shingo Yorisaki, Yasuhiro Motoyama, Masayoshi Okamoto et al
Title:
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Assignment: 1
Reel/Frame:
019698/0744Recorded: 08/15/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HASEBE, AKIO
Exec Dt:
06/14/2007
MATSUMOTO, HIDEYUKI
Exec Dt:
06/20/2007
YORISAKI, SHINGO
Exec Dt:
06/19/2007
MOTOYAMA, YASUHIRO
Exec Dt:
06/14/2007
OKAMOTO, MASAYOSHI
Exec Dt:
07/05/2007
NARIZUKA, YASUNORI
Exec Dt:
06/18/2007
OKAMOTO, NAOKI
Exec Dt:
06/29/2007
Assignee:
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
MATTINGLY,STANGER,MALUR&BRUNDIDGE, P.C.
1800 DIAGONAL ROAD
SUITE 370
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
024953/0672Recorded: 09/09/2010Pages: 42
Conveyance:
MERGER AND CHANGE OF NAME
Assignor:
RENESAS TECHNOLOGY CORP.
Exec Dt:
04/01/2010
Assignee:
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668
Correspondent:
MATTINGLY & MALUR, P.C.
1800 DIAGONAL RD.
SUITE 370
ALEXANDRIA, VA 22314

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