Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/24/2012
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Application #:
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12175348
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Filing Dt:
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07/17/2008
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Publication #:
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Pub Dt:
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01/22/2009
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Inventor:
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Shih-Ping Hsu
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Title:
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PACKAGING SUBSTRATE WITH CONDUCTIVE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN |
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SCHMEISER OLSEN & WATTS |
18 E UNIVERSITY DRIVE |
SUITE # 101 |
MESA, AZ 85201 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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NO. 38 HSING PONG RD., KWEI SAN INDUSTRIAL ZONE |
TAOYUAN, TAIWAN |
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SCHMEISER, OLSEN & WATTS LLP |
18 E. UNIVERSITY DRIVE, STE. 101 |
MESA, AZ 85201 |
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