Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/08/2011
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Application #:
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11898245
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Filing Dt:
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09/10/2007
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Publication #:
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Pub Dt:
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01/22/2009
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Inventors:
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Chi-Hsiung Cheng, Wan-Chen Chan, Hsun-Fa Li
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Title:
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METHOD AND MASK ASSEMBLY FOR FORMING SOLDER BODIES ON A SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 141, LANE 351, SEC. 1, TAI-PING RD., TSAO-TUN CHEN |
| NAN-TOU HSIEN, TAIWAN |
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| DAVIDSON BERQUIST JACKSON & GOWDEY, LLP |
| 4300 WILSON BLVD., 7TH FLOOR |
| ARLINGTON, VA 22203 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1558, ZHANG DONG ROAD |
| ZHANGJIANG HI-TECH PARK |
| SHANGHAI, CHINA 201203 |
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| 141, LANE 351, SEC. 1, TAIPING ROAD |
| TSAOTUEN, NANTOU, TAIWAN |
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| DAVIDSON BERQUIST JACKSON & GOWDEY, LLP |
| 4300 WILSON BLVD |
| 7TH FLOOR |
| ARLINGTON, VA 22203 |
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