Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12086152
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Filing Dt:
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07/11/2008
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Publication #:
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Pub Dt:
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01/22/2009
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Inventors:
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Yoshihito Horita, Shiyuki Kanisawa, Yoshihiro Yoneda, Takahiro Asada
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Title:
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PROCESS FOR PRODUCING THE FUNCTIONAL-ELEMENT-MOUNTED MODULE AND RESIN SEALING PLATE FOR USE THEREIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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GATE CITY OSAKI EAST TOWER 8F |
1-11-2, OSAKI, SHINAGAWA-KU |
TOKYO, JAPAN |
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KANESAKA BERNER & PARTNERS |
PATENT AGENTS, LLP |
1700 DIAGONAL ROAD, SUITE 310 |
ALEXANDRIA, VA 22314 |
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