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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7893527
Issue Dt:
02/22/2011
Application #:
12216375
Filing Dt:
07/02/2008
Publication #:
20090026604
Pub Dt:
01/29/2009
Inventors:
Joon-Sik Shin, Nobuyuki Ikeguchi, Keungjin Sohn, Joung-Gul Ryu, Sang-Youp Lee et al
Title:
SEMICONDUCTOR PLASTIC PACKAGE AND FABRICATING METHOD THEREOF
Assignment: 1
Reel/Frame:
021259/0034Recorded: 07/02/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SHIN, JOON-SIK
Exec Dt:
06/16/2008
IKEGUCHI, NOBUYUKI
Exec Dt:
06/16/2008
SOHN, KEUNGJIN
Exec Dt:
06/16/2008
RYI, JOUNG-GUL
Exec Dt:
06/16/2008
LEE, SANG-YOUP
Exec Dt:
06/16/2008
PARK, JUNG-HWAN
Exec Dt:
06/16/2008
PARK, HO-SIK
Exec Dt:
06/16/2008
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG
YEONGTONG-GU, SUWON
GYUNGGI-DO, KOREA, REPUBLIC OF 443-743
Correspondent:
STAAS & HALSEY LLP
ATTENTION: DAVID M. PITCHER
1201 NEW YORK AVE., N.W., SUITE 700
WASHINGTON, D.C. 20005
Assignment: 2
Reel/Frame:
021472/0072Recorded: 08/29/2008Pages: 4
Conveyance:
RECORD TO CORREC THE FOURTH INVENTOR'S NAME, PREIVOUSLY RECORDED ON REEL 021259 FRAME 0034.
Assignors:
SHIN, JOON-SIK
Exec Dt:
06/16/2008
IKEGUCHI, NOBUYUKI
Exec Dt:
06/16/2008
SOHN, KEUNGJIN
Exec Dt:
06/16/2008
RYU, JOUNG-GUL
Exec Dt:
06/16/2008
LEE, SANG-YOUP
Exec Dt:
06/16/2008
PARK, JUNG-HWAN
Exec Dt:
06/16/2008
PARK, HO-SIK
Exec Dt:
06/16/2008
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG
YEONGTONG-GU, SUWON
GYUNGGI-DO, KOREA, REPUBLIC OF 443-743
Correspondent:
STAAS & HALSEY LLP
ATTENTION: DAVID M. PITCHER
1201 NEW YORK AVE., N.W., SUITE 700
WASHINGTON, D.C. 20005

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