Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11836493
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Filing Dt:
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08/09/2007
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Publication #:
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Pub Dt:
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02/12/2009
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Inventors:
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Sakae Koyata, Takeo Katoh, Tomohiro Hashii, Kazushige Takaishi, Katsuhiko Murayama
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Title:
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METHOD FOR MANUFACTURING SILICON WAFERS USING ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1 SHIBAURA 1-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-8634 |
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| JULES E. GOLDBERG |
| 599 LEXINGTON AVENUE, 29TH FLOOR |
| REED SMITH, LLP |
| NEW YORK, NY 10022 |
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