Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/06/2010
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Application #:
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12216997
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Filing Dt:
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07/14/2008
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Publication #:
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Pub Dt:
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02/19/2009
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Inventors:
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Keiichi Yamamoto, Toru Okada
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Title:
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SOLDER REPAIRING APPARATUS AND METHOD OF REPAIRING SOLDER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME |
| NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211-8588, JAPAN |
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| STAAS & HALSEY LLP |
| ATTENTION: H.J. STAAS |
| 1201 NEW YORK AVE., N.W. - SUITE 700 |
| WASHGINTON, D.C. 20005 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME |
| NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211-8588, JAPAN |
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| STAAS & HALSEY LLP |
| ATTENTION: RICHARD A. GOLLHOFER, ESQ. |
| 1201 NEW YORK AVE., N.W., SUITE 700 |
| WASHINGTON, D.C. 20005 |
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