Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/24/2010
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Application #:
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12132641
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Filing Dt:
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06/04/2008
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Publication #:
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Pub Dt:
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03/05/2009
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Inventors:
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Zhiqi Wang, Guoqing Yu, Qinqin Xu, Wei Wang
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Title:
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WAFER LEVEL CHIP SIZE PACKAGE FOR MEMS DEVICES AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11 B/C, SUCHUN INDUSTRIAL SQUARE |
| 428 XINGLONG STREET |
| SUZHOU INDUSTRIAL PARK, CHINA 215126 |
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| CHRISTOPHER F. REGAN |
| 1901 S. HARBOR CITY BLVD |
| STE. 507 |
| MELBOURNE, FL 32901 |
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