Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/27/2010
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Application #:
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12119551
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Filing Dt:
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05/13/2008
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Publication #:
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Pub Dt:
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03/05/2009
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Inventors:
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HSIN-TANG CHIEN, CHIEH-LING HSIAO, CHIN-HUNG WANG
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Title:
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STACKED PACKAGE STRUCTURE FOR REDUCING PACKAGE VOLUME OF AN ACOUSTIC MICRO-SENSOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG-HSING RD.,CHU-TUNG |
| HSIN-CHU, TAIWAN |
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| WPAT, PC |
| 1940 DUKE ST., SUITE 200 |
| ALEXANDRIA, VA 22314 |
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