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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/20/2011
Application #:
12230273
Filing Dt:
08/27/2008
Publication #:
Pub Dt:
03/05/2009
Inventor:
Shih-Ping Hsu
Title:
PACKAGING SUBSTRATE STRUCTURE WITH ELECTRONIC COMPONENTS EMBEDDED IN A CAVITY OF A METAL BLOCK AND METHOD FOR FABRICATING THE SAME
Assignment: 1
Reel/Frame:
021497/0731Recorded: 08/22/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/22/2008
Assignee:
NO. 6, LI-HSIN RD.
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN R.O.C.
Correspondent:
EUGENE MAR
BACON & THOMAS, PLLC
625 SLATERS LANE, FOURTH FLOOR
ALEXANDRIA, VIRGINIA 22314
Assignment: 2
Reel/Frame:
026726/0419Recorded: 08/10/2011Pages: 4
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/13/2010
Assignee:
38, HSING PONG RD.
KWEI SAN INDUSTRIAL ZONE
TAOYUAN, TAIWAN
Correspondent:
BACON & THOMAS, PLLC
625 SLATERS LANE
4TH FLOOR
ALEXANDRIA, VA 22314-1176

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