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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/29/2010
Application #:
11849545
Filing Dt:
09/04/2007
Publication #:
Pub Dt:
03/05/2009
Inventors:
Jun Zhai, Ranjit Gannamani, Srinivasan Parthasarathy
Title:
SEMICONDUCTOR CHIP WITH STRATIFIED UNDERFILL
Assignment: 1
Reel/Frame:
019777/0833Recorded: 09/04/2007Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/28/2007
Exec Dt:
08/28/2007
Exec Dt:
08/28/2007
Assignee:
ONE AMD PLACE, PO BOX 3453
PAUL S. DRAKE
SUNNYVALE, CALIFORNIA 94088-3453
Correspondent:
TIMOTHY M. HONEYCUTT
PO BOX 1577
CYPRESS, TX 77410-1577
Assignment: 2
Reel/Frame:
047014/0777Recorded: 07/06/2018Pages: 22
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/26/2018
Assignee:
40 PLEASANT STREET
SUITE 208
PORTSMOUTH, NEW HAMPSHIRE 03801
Correspondent:
CATHERINE XU
ONE FINANCIAL CENTER
MINTZ LEVIN
BOSTON, MA 02111

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