Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/30/2011
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Application #:
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12162504
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Filing Dt:
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07/29/2008
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Publication #:
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Pub Dt:
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03/05/2009
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Inventors:
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Daisuke Suzuki, Masayuki Kondo
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Title:
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RESINOUS HOLLOW PACKAGE AND PRODUCING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-2, HIGASHI-SHIMBASHI 1-CHOME |
| MINATO-KU, TOKYO, JAPAN 105-7117 |
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| BUCHANAN INGERSOL & ROONEY PC |
| 1737 KING STREET |
| ALEXANDRIA, VA 22313-1404 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-7-43, KITA-KUNOMOTO, TENDO-SHI |
| YAMAGATA-KEN, JAPAN 994-8501 |
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| BUCHANAN, INGERSOLL & ROONEY PC |
| 1737 KING STREET |
| SUITE 500 |
| ALEXANDRIA, VA 22314 |
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