Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12206032
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Filing Dt:
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09/08/2008
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Publication #:
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Pub Dt:
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03/12/2009
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Inventors:
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Kenichi UCHIYAMA, Tomohiro Takase, Ikuo Uematsu, Shingo Kasai
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Title:
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Method for Measuring Sample, Package for Sensor Chips, and Mechanism for Fixing Sensor Chips
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-1, SHIBAURA 1-CHOME, MINATO-KU |
TOKYO, JAPAN |
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E. CHAPMAN - FHFGD |
901 NEW YORK AVE., NW |
WASHINGTON, DC 20001 |
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