Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/02/2010
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Application #:
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12283538
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Filing Dt:
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09/12/2008
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Publication #:
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Pub Dt:
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03/19/2009
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Inventors:
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Lin-Yin Wong, Mao-Hua Yeh
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Title:
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PACKAGING SUBSTRATE HAVING HEAT-DISSIPATING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN ROC |
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| PETER F. CORLESS |
| EDWARDS ANGELL PALMER & DODGE LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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