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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/11/2011
Application #:
11855290
Filing Dt:
09/14/2007
Publication #:
Pub Dt:
03/19/2009
Inventors:
Bruce K. Furman, Jae-Woong Nah
Title:
THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE AND METHOD
Assignment: 1
Reel/Frame:
019827/0290Recorded: 09/14/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/13/2007
Exec Dt:
09/13/2007
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
JACK P. FRIEDMAN-SCHMEISER, OLSEN &WATTS
22 CENTURY HILL DRIVE, SUITE 302
LATHAM, NY 12110
Assignment: 2
Reel/Frame:
032523/0745Recorded: 03/25/2014Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/05/2013
Assignees:
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondent:
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306

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