Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/17/2009
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Application #:
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12187622
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Filing Dt:
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08/07/2008
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Publication #:
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Pub Dt:
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03/19/2009
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Inventors:
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Hiroyuki TENMEI, Kunihiko NISHI, Nae HISANO, Masakazu ISHINO, Yasuhiro NAKA et al
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Title:
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BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED THEREBY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, YAESU 2-CHOME |
| CHUO-KU, TOKYO, JAPAN |
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| 6-6, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| SHRINATH MALUR |
| 1800 DIAGONAL RD, SUITE 370 |
| ALEXANDRIA, VA 22314 |
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