Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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12211862
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Filing Dt:
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09/17/2008
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Publication #:
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Pub Dt:
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03/26/2009
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Inventors:
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Masanori Miyata, Hidetsugu Miyake, Fumihiro Fuchino, Akira Washino, Tadao Uehara et al
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Title:
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SEMICONDUCTOR WAFER, SEMICONDUCTOR CHIP CUT FROM THE SEMICONDUCTOR WAFER, AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-6, NAKAMAGOME 1-CHOME, OHTA-KU |
| TOKYO, JAPAN 143-8555 |
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| DICKSTEIN SHAPIRO LLP |
| 1825 EYE STREET NW |
| WASHINGTON, DC 20006-5403 |
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