Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12239146
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Filing Dt:
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09/26/2008
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Publication #:
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Pub Dt:
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04/02/2009
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Inventor:
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Yuma Horio
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Title:
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THERMOELECTRIC MODULE SUBSTRATE AND THERMOELECTRIC MODULE USING SUCH BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-1 NAKAZAWA-CHO, NAKA-KU |
| HAMAMATSU-SHI |
| SHIZUOKA-KEN, JAPAN |
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| DICKSTEIN SHAPIRO LLP |
| 1177 AVENUE OF THE AMERICAS (6TH AVENUE) |
| NEW YORK, NY 10036-2714 |
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