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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12286003
Filing Dt:
09/26/2008
Publication #:
Pub Dt:
04/09/2009
Inventor:
John Flake
Title:
Electrochemical etching of through silicon vias
Assignment: 1
Reel/Frame:
022089/0547Recorded: 01/09/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/08/2008
Assignee:
206 LOUISIANA EMERGING TECHNOLOGY CENTER
BOCA ROUE, LOUISIANA 70803
Correspondent:
JASON P. MUELLER
ADAMS AND REESE, LLP
701 POYDRAS STREET, #4500
NEW ORLEANS, LOUISIANA 70139

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