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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12251624
Filing Dt:
10/15/2008
Publication #:
20090102038
Pub Dt:
04/23/2009
Inventors:
SIMON J.S. MCELREA, Marc E. Robinson, Lawrence Douglas Andrews JR., Terrence Caskey et al
Title:
CHIP SCALE STACKED DIE PACKAGE
Assignment: 1
Reel/Frame:
022021/0936Recorded: 12/23/2008Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MCELREA, SIMON J. S
Exec Dt:
12/02/2008
ROBINSON, MARC E
Exec Dt:
11/25/2008
ANDREWS, LAWRENCE DOUGLAS, JR
Exec Dt:
11/26/2008
CASKEY, TERRENCE
Exec Dt:
12/12/2008
MCGRATH, SCOTT
Exec Dt:
11/26/2008
DU, YONG
Exec Dt:
12/05/2008
VINDASIUS, AL
Exec Dt:
12/11/2008
Assignee:
VERTICAL CIRCUITS, INC.
10 VICTOR SQUARE
SCOTTS VALLEY, CALIFORNIA 95066
Correspondent:
BILL KENNEDY, HAYNES BEFFEL & WOLFELD LL
PO BOX 366
HALF MOON BAY, CA 94019
Assignment: 2
Reel/Frame:
029186/0755Recorded: 10/24/2012Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
VERTICAL CIRCUITS, INC.
Exec Dt:
10/23/2012
Assignee:
VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
1100 LA AVENIDA STREET
BUILDING A
MOUNTAIN VIEW, CALIFORNIA 94043
Correspondent:
BILL KENNEDY
625 MIRAMONTES STREET
SUITE 201
HALF MOON BAY, CA 94019

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