Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12247080
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Filing Dt:
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10/07/2008
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Publication #:
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Pub Dt:
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04/23/2009
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Inventors:
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Hideki TOKUYAMA, Yohei ONISHI
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Title:
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METHOD OF SEALING AND MOLDING ELECTRONIC COMPONENT WITH RESIN AND MOLD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5, KAMITOBA KAMICHOSHI-CHO, MINAMI-KU |
| KYOTO-SHI, KYOTO, JAPAN 601-8105 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP. |
| P. O. BOX 747 |
| FALLS CHURCH, VA 22042-0747 |
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