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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/05/2012
Application #:
11922476
Filing Dt:
12/19/2007
Publication #:
Pub Dt:
04/30/2009
Inventor:
Tadahiro Ohmi
Title:
INTERLAYER INSULATING FILM, INTERCONNECTION STRUCTURE, AND METHODS OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
020300/0222Recorded: 12/19/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/17/2007
Assignees:
1-1, KATAHIRA 2-CHOME, AOBA-KU, SENDAI-SHI
MIYAGI, 980-8577, JAPAN
586-9, AZA USHIGAFUCHI, AKATSUKA
TSUKUBA-SHI, IBARAKI, 305-0062, JAPAN
Correspondent:
GEORGE C. BECK
FOLEY & LARDNER LLP
WASHINGTON HARBOUR
3000 K STREET NW, SUITE 500
WASHINGTON, D.C. 20007-5143

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