Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12289260
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Filing Dt:
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10/23/2008
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Publication #:
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Pub Dt:
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04/30/2009
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Inventor:
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Seiya Fujii
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Title:
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Wiring board of semiconductor device, semiconductor device, electronic apparatus, mother board, method of manufacturing wiring board of semiconductor device, method of manufacturing mother board and method of manufacturing electronic apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, YAESU 2-CHOME, CHUO-KU |
| TOKYO, JAPAN |
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| SEAN M. MCGINN, ESQ. |
| MCGINN IP LAW GROUP, PLLC |
| 8321 OLD COURTHOUSE ROAD |
| SUITE 200 |
| VIENNA, VIRGINIA 22182-3817 |
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