Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11934007
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Filing Dt:
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11/01/2007
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Publication #:
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Pub Dt:
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05/07/2009
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Inventors:
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Lap-Wai Lydia Leung, Yu-Chih Chen, Chi Kuen Leung, Jyh-Rong Lin, Chang Hwa Chung
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Title:
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Electronic Circuit Package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3RD FLOOR, BUILDING 6, 2 SCIENCE PARK WEST AVENUE |
| HONG KONG SCIENCE PARK |
| SHATIN, NEW TERRITORIES, HONG KONG |
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| JAMES D. SHAURETTE |
| WELLS ST. JOHN, P.S. |
| 601 W. FIRST AVE., #1300 |
| SPOKANE, WA 99201 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3RD FLOOR, BUILDING 6, 2 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK, |
| SHATIN, NEW TERRITORIES, HONG KONG |
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| JAMES D. SHAURETTE |
| WELLS ST. JOHN P.S. |
| 601 WEST FIRST AVENUE, SUITE 1300 |
| SPOKANE, WA 99201-3828 |
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