Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/16/2010
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Application #:
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11917241
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Filing Dt:
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07/18/2008
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Publication #:
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Pub Dt:
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05/14/2009
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Inventors:
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Kazunari Maki, Yuji Nakata
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Title:
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GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS AND HIGH RESIN FLOWABILITY RESISTANCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TOKYO BUILDING 22F, 2-7-3, MARUNOUCHI, CHIYODA-KU |
| TOKYO, JAPAN |
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| JOSEPH R. ROBINSON |
| P.O. BOX 770, CHURCH STREET STATION |
| NEW YORK, NY 10008-0770 |
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